The CIQTEK DB550 dual-beam FIB-SEM brings together high-resolution electron imaging and precision ion beam processing on a single platform.
CIQTEK has validated its DB550 Focused Ion Beam Scanning Electron Microscope (FIB-SEM) on real 5nm process node chip samples, demonstrating production-ready TEM sample preparation with intact fin structures, zero amorphization, and clearly resolved film layers. The results confirm that the DB550 meets the exacting demands of advanced semiconductor failure analysis labs working at the cutting edge of process technology.
In advanced chip research and manufacturing, two tools matter above all others. The Transmission Electron Microscope (TEM) lets you see structures at the atomic scale. But before you can look, you need a sample thin enough for electrons to pass through. That is where the dual-beam FIB-SEM comes in. It is the precision workshop that prepares those ultra-thin specimens.
Meet the DB550: One Platform for Imaging and Nanoscale Processing
The CIQTEK DB550 FIB-SEM integrates two powerful capabilities onto a single platform. On one side, a scanning electron microscope (SEM) delivers high-resolution surface imaging. On the other, a focused ion beam (FIB) performs nanoscale material removal with surgical precision. Together, they bridge the gap between observation and fabrication at dimensions measured in billionths of a meter.
At the heart of the DB550 sits a low-voltage, high-resolution electron column paired with CIQTEK's proprietary "Chengying" ion column, developed entirely in-house. The Chengying column is the engine behind the system's nanoscale cutting and etching capabilities. CIQTEK controls the full design and manufacturing pipeline for this critical component.
The 5nm Challenge: Why Sample Preparation Gets Harder at Every Node
At 5nm and below, chip architectures rely on fin-type field-effect transistors (FinFETs) with fin widths and pitches measured in just a few nanometers. The DB550 is designed to handle the full sample preparation workflow for these demanding process nodes. It starts with high-current rough cutting to quickly remove bulk material and reach the target region. Then it transitions to low-voltage fine polishing to thin the sample to TEM-ready dimensions without damaging the delicate structures underneath.
TEM Validation: The Proof Is in the Image
CIQTEK prepared a 5nm process node chip sample on the DB550 and transferred it to a TEM for characterization. The results speak for themselves.
TEM characterization of a 5nm chip sample prepared on the DB550 shows intact fin structures with clear, well-defined film layers and no amorphization damage.
The TEM images revealed that the fin structures remained completely intact after FIB preparation. There was no detectable amorphization in the silicon crystal lattice. The individual film layers appeared clear and sharply defined in the TEM cross-section. These results validate the dual-beam sample preparation performance of the DB550 on the most advanced process nodes.
Engineered for Reliability, Built for the Long Term
Electron microscopes are the core tool in semiconductor failure analysis labs. CIQTEK develops the DB550 from the ground up, covering the full technology stack from core hardware to underlying algorithms. The proprietary Chengying ion column, the electron optics, the stage mechanics, and the control software are all designed and optimized as an integrated system.
Owning the full design strengthens supply chain resilience. Every critical component is sourced through CIQTEK's controlled development pipeline. For semiconductor labs that depend on instrument uptime for production yield analysis and failure investigations, this predictability matters.
CIQTEK backs the DB550 with continuous, reliable, and responsive technical support. The company also provides application support to help labs develop and optimize preparation recipes for new process nodes and novel device architectures.
